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MBRS140LT3 Surface Mount Schottky Power Rectifier
SMB Power Surface Mount Package
. . . employing the Schottky Barrier principle in a metal-to-silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes.
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* * * * * * * * * * * *
Compact Package with J-Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over-Voltage Protection Low Forward Voltage Drop Case: Molded Epoxy Epoxy Meets UL94, VO at 1/8 Weight: 95 mg (approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Available in 12 mm Tape, 2500 Units per 13 Reel, Add "T3" Suffix to Part Number Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Marking: B14L
SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 40 VOLTS
Mechanical Characteristics:
SMB CASE 403A PLASTIC
MARKING DIAGRAM
B14L
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 110C) Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 110C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage/Operating Case Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25C) Symbol VRRM VRWM VR IO IFRM Value 40 Unit V
B14L = Device Code
1.0 2.0
A A
ORDERING INFORMATION
Device MBRS140LT3 Package SMB Shipping 2500/Tape & Reel
IFSM
40
A
Tstg, TC TJ dv/dt
-55 to +150 -55 to +125 10,000
C C V/ms
(c) Semiconductor Components Industries, LLC, 2000
1
October, 2000 - Rev. 2
Publication Order Number: MBRS140LT3/D
MBRS140LT3
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance -- Junction-to-Lead (Note 1.) Thermal Resistance -- Junction-to-Ambient (Note 2.) Symbol RJL RJA Max 24 80 Unit C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3 ) 3.) see Figure 2 Maximum Instantaneous Reverse Current (Note 3 ) 3.) see Figure 4 (VR = 40 V) (VR = 20 V) (iF = 1.0 A) (iF = 2.0 A) IR vF TJ = 25C 0.5 0.6 TJ = 25C 0.4 0.02 TJ = 125C 0.425 0.58 TJ = 100C 10 5.0 mA Volts
1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 3. Pulse Test: Pulse Width 250 s, Duty Cycle 2.0%.
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MBRS140LT3
i F, INSTANTANEOUS FORWARD CURRENT (AMPS) IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 100
10
10
1.0
TJ = 125C 100C
1.0
TJ = 125C 100C 25C
25C -40C
0.1
0.1
0.3
0.5
0.7
0.9
0.1
0.1
0.3
0.5
0.7
0.9
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
100E-3 IR , REVERSE CURRENT (AMPS) 10E-3
100E-3 IR , MAXIMUM REVERSE CURRENT (AMPS) TJ = 125C 10E-3 1.0E-3 25C 100C
TJ = 125C 100C
1.0E-3
100E-6 10E-6 25C 0 10 20 30
100E-6 10E-6 1.0E-6
1.0E-6
40
0
10
20
30
40
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
IO , AVERAGE FORWARD CURRENT (AMPS)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 25 45
dc SQUARE WAVE Ipk/Io = p Ipk/Io = 5.0 Ipk/Io = 10 Ipk/Io = 20
PFO , AVERAGE POWER DISSIPATION (WATTS)
1.6
0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Ipk/Io = p Ipk/Io = 5.0 Ipk/Io = 10 Ipk/Io = 20 SQUARE WAVE dc
FREQ = 20 kHz
65
85
105
125
TL, LEAD TEMPERATURE (C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
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MBRS140LT3
TJ , DERATED OPERATING TEMPERATURE ( C) 1000 TJ = 25C C, CAPACITANCE (pF) 125 115 105 95 85 75 65 0 5.0 10 15 20 25 30 35 40 44C/W 24C/W
63C/W
80C/W Rtja = 94C/W
100
10
0
5.0
10
15
20
25
30
35
40
VR, REVERSE VOLTAGE (VOLTS)
VR, DC REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
Figure 8. Typical Operating Temperature Derating*
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any reverse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating TJ = TJmax - r(t)(Pf + Pr) where TJ may be calculated from the equation: r(t) = thermal impedance under given conditions, Pf = forward power dissipation, and Pr = reverse power dissipation This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax - r(t)Pr, where r(t) = Rthja. For other power applications further calculations must be performed. 50% 20% 10% 5.0% 2.0% 1.0%
1.0E+00
1.0E-01
1.0E-02
1.0E-03
Rtjl(t) = Rtjl*r(t)
1.0E-04
0.00001
0.0001
0.001
0.01
0.1 t, TIME (s)
1.0
10
100
1000
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 9. Thermal Response -- Junction to Lead
50% 20% 10% 5.0% 2.0% 1.0%
1.0E+00
1.0E-01
1.0E-02
1.0E-03
Rtjl(t) = Rtjl*r(t)
1.0E-04
0.00001
0.0001
0.001
0.01
0.1 t, TIME (s)
1.0
10
100
1000
Figure 10. Thermal Response -- Junction to Ambient http://onsemi.com
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MBRS140LT3
MINIMUM SOLDER PAD SIZES
0.089 2.261
0.108 2.743
inches mm
0.085 2.159
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MBRS140LT3
PACKAGE DIMENSIONS
S A
SMB PLASTIC PACKAGE CASE 403A-03 ISSUE D
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
D
B
C
INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220
MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
K
P
J
H
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MBRS140LT3
Notes
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MBRS140LT3
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MBRS140LT3/D

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